Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Abstract. Most currently proposed solutions to application-level multicast organize the group members into an application-level mesh over which a DistanceVector routing protocol, o...
Sylvia Ratnasamy, Mark Handley, Richard M. Karp, S...
Existing solutions for top-k queries in wireless sensor networks mainly focused on energy efficiency and little attention has been paid to the response time to answer a top-k que...
This paper presents a process algebra for specifying soft real-time constraints in a compositional way. For these soft constraints we take a stochastic point of view and allow arb...
Pedro R. D'Argenio, Joost-Pieter Katoen, Ed Brinks...
In todays IP networks most of the network control and management tasks are performed at the end points. As a result, many important network functions cannot be optimized due to la...