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DAC
2010
ACM
14 years 16 days ago
TSV stress aware timing analysis with applications to 3D-IC layout optimization
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee,...
DAC
2005
ACM
13 years 10 months ago
Design methodology for IC manufacturability based on regular logic-bricks
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
V. Kheterpal, V. Rovner, T. G. Hersan, D. Motiani,...
SIGUCCS
2006
ACM
14 years 2 months ago
Better results in mathematics lessons with a virtual personal teacher
In this paper we present the results of an experiment made with our e-librarian service ”MatES”, an e-Learning tool on fractions in mathematics. MatES allows students to enter...
Serge Linckels, Carole Dording, Christoph Meinel
SOSP
2007
ACM
14 years 5 months ago
Bouncer: securing software by blocking bad input
Attackers exploit software vulnerabilities to control or crash programs. Bouncer uses existing software instrumentation techniques to detect attacks and it generates filters auto...
Manuel Costa, Miguel Castro, Lidong Zhou, Lintao Z...
HT
2006
ACM
14 years 2 months ago
Social navigation in web lectures
Web lectures are a form of educational content that differs from classic hypertext in a number of ways. Web lectures are easier to produce and therefore large amounts of material ...
Robert Mertens, Rosta Farzan, Peter Brusilovsky