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TCAD
2002
13 years 8 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
KDD
2005
ACM
14 years 9 months ago
2005
ACM
Computer architects utilize simulation tools to evaluate the merits of a new design feature. The time needed to adequately evaluate the tradeoffs associated with adding any new fe...
WISEC
2010
ACM
14 years 1 months ago
2010
ACM
Key management in wireless sensor networks does not only face typical, but also several new challenges. The scale, resource limitations, and new threats such as node capture and c...
CVPR
2008
IEEE
14 years 10 months ago
2008
IEEE
The robust alignment of images and scenes seen from widely different viewpoints is an important challenge for camera and scene reconstruction. This paper introduces a novel class ...
VIS
2004
IEEE
14 years 10 months ago
2004
IEEE
We present a new level set method for reconstructing interfaces from point aggregations. Although level-set-based methods are advantageous because they can handle complicated topo...