Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
Computer architects utilize simulation tools to evaluate the merits of a new design feature. The time needed to adequately evaluate the tradeoffs associated with adding any new fe...
Kaushal Sanghai, Ting Su, Jennifer G. Dy, David R....
Key management in wireless sensor networks does not only face typical, but also several new challenges. The scale, resource limitations, and new threats such as node capture and c...
Matthias Wilhelm, Ivan Martinovic, Jens B. Schmitt
The robust alignment of images and scenes seen from widely different viewpoints is an important challenge for camera and scene reconstruction. This paper introduces a novel class ...
Changchang Wu, Brian Clipp, Xiaowei Li, Jan-Michae...
We present a new level set method for reconstructing interfaces from point aggregations. Although level-set-based methods are advantageous because they can handle complicated topo...