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DAC
2007
ACM
14 years 8 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
GLOBECOM
2009
IEEE
14 years 2 months ago
Design of Signal Constellation Rearrangement (CoRe) for Multiple Relay Links
Abstract – This paper considers a design of signal constellations for trans-modulation (constellation rearrangement: CoRe) in a relay system with the multiple links in which the ...
Jin Woo Kim, Hee S. Lee, Jae Yung Ahn, Chung Gu Ka...
MM
2006
ACM
166views Multimedia» more  MM 2006»
14 years 1 months ago
Video retargeting: automating pan and scan
When a video is displayed on a smaller display than originally intended, some of the information in the video is necessarily lost. In this paper, we introduce Video Retargeting th...
Feng Liu, Michael Gleicher
DAC
1999
ACM
14 years 8 months ago
Engineering Change: Methodology and Applications to Behavioral and System Synthesis
Due to the unavoidable need for system debugging, performance tuning, and adaptation to new standards, the engineering change (EC) methodology has emerged as one of the crucial co...
Darko Kirovski, Miodrag Potkonjak
DAC
2005
ACM
14 years 8 months ago
Logic block clustering of large designs for channel-width constrained FPGAs
In this paper we present a system level technique for mapping large, multiple-IP-block designs to channel-width constrained FPGAs. Most FPGA clustering tools [2, 3, 11] aim to red...
Marvin Tom, Guy G. Lemieux