The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
DED ABSTRACT The increased popularity and the growth in the number of deployed IEEE 802.11 Access Points (APs) have raised the opportunity to merge together various disjointed wire...
Rosario Giuseppe Garroppo, Stefano Giordano, David...
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Data center networks encode locality and topology information into their server and switch addresses for performance and routing purposes. For this reason, the traditional address...
Kai Chen, Chuanxiong Guo, Haitao Wu, Jing Yuan, Zh...
In order to handle device matching in analog circuits, some pairs of modules are required to be placed symmetrically. This paper addresses this device-level placement problem for ...
Yiu-Cheong Tam, Evangeline F. Y. Young, Chris C. N...