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» An Experimental Analysis of Parallel
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IPCV
2007
13 years 9 months ago
Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights
- The shrunk dimension of electronic devices leads to more stringent requirement on process control and quality assurance of their fabrication. For instance, direct die-to-die bond...
Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. ...
AES
2006
Springer
106views Cryptology» more  AES 2006»
13 years 8 months ago
A grid-enabled problem solving environment for parallel computational engineering design
This paper describes the development and application of a piece of engineering software that provides a Problem Solving Environment (PSE) capable of launching, and interfacing wit...
C. E. Goodyer, Martin Berzins, Peter K. Jimack, L....
JPDC
2008
129views more  JPDC 2008»
13 years 8 months ago
A framework for scalable greedy coloring on distributed-memory parallel computers
We present a scalable framework for parallelizing greedy graph coloring algorithms on distributed-memory computers. The framework unifies several existing algorithms and blends a ...
Doruk Bozdag, Assefaw Hadish Gebremedhin, Fredrik ...
FGCS
2007
106views more  FGCS 2007»
13 years 8 months ago
A parallel hybrid genetic algorithm for protein structure prediction on the computational grid
Solving the structure prediction problem for complex proteins is difficult and computationally expensive. In this paper, we propose a bicriterion parallel hybrid genetic algorith...
Alexandru-Adrian Tantar, Nouredine Melab, El-Ghaza...
VLSID
2009
IEEE
96views VLSI» more  VLSID 2009»
14 years 8 months ago
Efficient Placement of Compressed Code for Parallel Decompression
Code compression is important in embedded systems design since it reduces the code size (memory requirement) and thereby improves overall area, power and performance. Existing res...
Xiaoke Qin, Prabhat Mishra