Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
An ever increasing number of dynamic interactive applications are implemented on portable consumer electronics. Designers depend largely on operating systems to map these applicat...
Francesco Poletti, Paul Marchal, David Atienza, Lu...
Dynamically reconfigurable logic is becoming an important design unit in SoC system. A method to make the reconfiguration management transparent to software applications is requir...
Various scratchpad allocation strategies have been developed in the past. Most of them target the reduction of energy consumption. These approaches share the necessity of having d...
— Leveraging the power of scratchpad memories (SPMs) available in most embedded systems today is crucial to extract maximum performance from application programs. While regular a...
Taylan Yemliha, Shekhar Srikantaiah, Mahmut T. Kan...