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ISCAS
2006
IEEE
121views Hardware» more  ISCAS 2006»
14 years 1 months ago
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
Francisco Tejada, Andreas G. Andreou
COMPUTER
2002
196views more  COMPUTER 2002»
13 years 7 months ago
Grid Services for Distributed System Integration
ions and concepts that let applications access and share resources and services across distributed, wide area networks, while providing common security semantics, distributed resou...
Ian T. Foster, Carl Kesselman, Jeffrey M. Nick, St...
DAC
2007
ACM
14 years 8 months ago
High Performance and Low Power Electronics on Flexible Substrate
We propose a design and optimization methodology for high performance and ultra low power digital applications on flexible substrate using Low Temperature Polycrystalline Silicon ...
Jing Li, Kunhyuk Kang, Aditya Bansal, Kaushik Roy
WWW
2004
ACM
14 years 8 months ago
Personalization in distributed e-learning environments
Personalized support for learners becomes even more important, when e-Learning takes place in open and dynamic learning and information networks. This paper shows how to realize p...
Peter Dolog, Nicola Henze, Wolfgang Nejdl, Michael...
CAISE
2007
Springer
14 years 1 months ago
Publishing and Discovering Information and Services for Tagged Products
Radio frequency identification (RFID), and more recently the development of Near Field Communication (NFC) technology, have popularized the idea of linking real-world products wit...
Christof Roduner, Marc Langheinrich