Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
— We consider the problem of small-gain analysis of asymptotic behavior in interconnected nonlinear dynamic systems. Mathematical models of these systems are allowed to be uncert...
Ivan Tyukin, Erik Steur, Henk Nijmeijer, Cees van ...
The heterogeneity of modern MPSoC architectures, coupled with the increasing complexity of the applications mapped onto them has recently led to a lot of interest in hybrid perfor...
Frank E. B. Ophelders, Samarjit Chakraborty, Henk ...
Statistical behavior of device leakage and threshold voltage shows a strong width dependency under microscopic random dopant fluctuation. Leakage estimation using the conventional...
Networks-on-Chip (NoCs) have recently emerged as a scalable alternative to classical bus and point-to-point architectures. To date, performance evaluation of NoC designs is largel...