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CODES
2007
IEEE
14 years 2 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
DDECS
2007
IEEE
102views Hardware» more  DDECS 2007»
14 years 2 months ago
IP Integration Overhead Analysis in System-on-Chip Video Encoder
—Current system-on-chip implementations integrate IP blocks from different vendors. Typical problems are incompatibility and integration overheads. This paper presents a case stu...
Antti Rasmus, Ari Kulmala, Erno Salminen, Timo D. ...
ICS
1999
Tsinghua U.
14 years 5 days ago
Improving the performance of speculatively parallel applications on the Hydra CMP
Hydra is a chip multiprocessor (CMP) with integrated support for thread-level speculation. Thread-level speculation provides a way to parallelize sequential programs without the n...
Kunle Olukotun, Lance Hammond, Mark Willey
ITNG
2008
IEEE
14 years 2 months ago
Parallel FFT Algorithms on Network-on-Chips
This paper presents several parallel FFT algorithms with different degree of communication overhead for multiprocessors in Network-on-Chip(NoC) environment. Three different method...
Jun Ho Bahn, Jungsook Yang, Nader Bagherzadeh
ICPPW
2008
IEEE
14 years 2 months ago
Performance Analysis and Optimization of Parallel Scientific Applications on CMP Cluster Systems
Chip multiprocessors (CMP) are widely used for high performance computing. Further, these CMPs are being configured in a hierarchical manner to compose a node in a cluster system....
Xingfu Wu, Valerie E. Taylor, Charles W. Lively, S...