3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
—Current system-on-chip implementations integrate IP blocks from different vendors. Typical problems are incompatibility and integration overheads. This paper presents a case stu...
Antti Rasmus, Ari Kulmala, Erno Salminen, Timo D. ...
Hydra is a chip multiprocessor (CMP) with integrated support for thread-level speculation. Thread-level speculation provides a way to parallelize sequential programs without the n...
This paper presents several parallel FFT algorithms with different degree of communication overhead for multiprocessors in Network-on-Chip(NoC) environment. Three different method...
Chip multiprocessors (CMP) are widely used for high performance computing. Further, these CMPs are being configured in a hierarchical manner to compose a node in a cluster system....
Xingfu Wu, Valerie E. Taylor, Charles W. Lively, S...