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DAC
2009
ACM
14 years 9 months ago
Spectral techniques for high-resolution thermal characterization with limited sensor data
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
Ryan Cochran, Sherief Reda
INTEGRATION
2007
95views more  INTEGRATION 2007»
13 years 8 months ago
Wire shaping of RLC interconnects
The optimum wire shape to produce the minimum signal propagation delay across an RLC line is shown to exhibit a general exponential form. The line inductance makes exponential tap...
Magdy A. El-Moursy, Eby G. Friedman
DAC
2009
ACM
14 years 9 months ago
Thermal-driven analog placement considering device matching
With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the ther...
Po-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-...
DAC
1999
ACM
14 years 9 months ago
Gate-Level Design Exploiting Dual Supply Voltages for Power-Driven Applications
The advent of portable and high-density devices has made power consumption a critical design concern. In this paper, we address the problem of reducing power consumption via gate-...
Ching-Wei Yeh, Min-Cheng Chang, Shih-Chieh Chang, ...
DAC
2004
ACM
14 years 9 months ago
FPGA power reduction using configurable dual-Vdd
Power optimization is of growing importance for FPGAs in nanometer technologies. Considering dual-Vdd technique, we show that configurable power supply is required to obtain a sat...
Fei Li, Yan Lin, Lei He