1398 search results - page 14 / 280 » Application-Specific Integrated Circuits |
ITC
1996
IEEE
13 years 12 months ago
1996
IEEE
The P1149.4 mixed-signal boundary scan standard is demonstrated with a CMOS integrated circuit. Design issues and characterization data are presented.
CLEIEJ
2010
13 years 5 months ago
2010
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
INTEGRATION
2008
13 years 7 months ago
2008
Variation is a significant concern in nanometer-scale CMOS due to manufacturing equipment being pushed to fundamental limits, particularly in lithography. In this paper, we review...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
ISCAS
2007
IEEE
14 years 2 months ago
2007
IEEE
— Employing multiple supply voltages (multi-VDD) is attractive for reducing the power consumption without sacrificing the speed of an integrated circuit (IC). In order to transfe...