Combining theorem proving and model checking o ers the tantalizing possibility of e ciently reasoning about large circuits at high levels of abstraction. We have constructed a syst...
Mark Aagaard, Robert B. Jones, Carl-Johan H. Seger
With the recent advent of deep sub-micron technology and new packaging schemes such as Multi-Chip Modules(MCMs), integrated circuit components are often not rectangular. Most exis...
In the future, advanced integrated circuit processing and packaging technology will allow for several design options for multiprocessor microprocessors. In this paper we consider ...
Advances in IC processing allow for more microprocessor design options. The increasing gate density and cost of wires in advanced integrated circuit technologies require that we l...
Kunle Olukotun, Basem A. Nayfeh, Lance Hammond, Ke...
{ Mobile and personal communication systems form key market areas for the electronics industry of the nineties. Stringent requirements in terms of
exibility, performance and power...
Gert Goossens, Ivo Bolsens, Bill Lin, Francky Catt...