2504 search results - page 406 / 501 » Architectural Design of Flexible Process Management Technolo... |
117
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
135
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DAC
2004
ACM
16 years 5 months ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
150
Voted
DAC
2005
ACM
16 years 5 months ago
2005
ACM
: Due to exponential increase in subthreshold leakage with technology scaling and temperature increase, leakage power is becoming a major fraction of total power in the active mode...
126
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DAC
2006
ACM
16 years 5 months ago
2006
ACM
Modern integrated circuits require careful attention to the soft-error rate (SER) resulting from bit upsets, which are normally caused by alpha particle or neutron hits. These eve...
151
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CIKM
2009
Springer
15 years 11 months ago
2009
Springer
Well-designed indices can dramatically improve query performance. Including query workload information can produce indices that yield better overall throughput while balancing the...