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DAC
2009
ACM
14 years 10 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
DAC
2004
ACM
14 years 10 months ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
DAC
2005
ACM
14 years 10 months ago
2005
ACM
: Due to exponential increase in subthreshold leakage with technology scaling and temperature increase, leakage power is becoming a major fraction of total power in the active mode...
DAC
2006
ACM
14 years 10 months ago
2006
ACM
Modern integrated circuits require careful attention to the soft-error rate (SER) resulting from bit upsets, which are normally caused by alpha particle or neutron hits. These eve...
CIKM
2009
Springer
14 years 3 months ago
2009
Springer
Well-designed indices can dramatically improve query performance. Including query workload information can produce indices that yield better overall throughput while balancing the...