— The world of 3D graphics, until recently restricted to high-end workstations and game consoles, is rapidly expanding into the domain of mobile platforms such as cellular phones...
Mapping packet processing applications onto embedded network processors (NP) is a challenging task due to the unique constraints of NP systems and the characteristics of network a...
Jia Yu, Jingnan Yao, Jun Yang 0002, Laxmi N. Bhuya...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...