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DAC
2009
ACM
14 years 8 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
TSE
2008
131views more  TSE 2008»
13 years 6 months ago
Enhancing an Application Server to Support Available Components
Three-tier middleware architecture is commonly used for hosting enterprise-distributed applications. Typically, the application is decomposed into three layers: front end, middle t...
Achmad I. Kistijantoro, Graham Morgan, Santosh K. ...
MOBISYS
2010
ACM
13 years 9 months ago
ParkNet: drive-by sensing of road-side parking statistics
Urban street-parking availability statistics are challenging to obtain in real-time but would greatly benefit society by reducing traffic congestion. In this paper we present the ...
Suhas Mathur, Tong Jin, Nikhil Kasturirangan, Jana...
DAC
2005
ACM
14 years 8 months ago
Power emulation: a new paradigm for power estimation
In this work, we propose a new paradigm called power emulation, which exploits hardware acceleration to drastically speedup power estimation. Power emulation is based on the obser...
Joel Coburn, Srivaths Ravi, Anand Raghunathan
ISMAR
2002
IEEE
14 years 7 days ago
Augmented Chemistry: An Interactive Educational Workbench
This system paper reports on some of the advantages tangible interaction can bring to chemistry education. The paper describes the realisation of an in-house designed Tangible Use...
Morten Fjeld, Benedikt M. Voegtli