613 search results - page 86 / 123 » Block cache for embedded systems |
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ICDCS
1998
IEEE
13 years 12 months ago
1998
IEEE
In distributed object systems, remote method inattempts to abstract communication between di erent machines to the level of object method invocation. Link failure in such systems ...
INFOCOM
1998
IEEE
13 years 12 months ago
1998
IEEE
This paper addresses a fundamental problem in resource management for flow-based hybrid switching systems. Such systems aim at efficient transport of layer-3 connectionless IP traf...
CODES
2000
IEEE
14 years 1 days ago
2000
IEEE
Memory interleaving is a cost-efficient approach to increase bandwidth. Improving data access locality and reducing memory access conflicts are two important aspects to achieve hi...
RTCSA
1998
IEEE
13 years 12 months ago
1998
IEEE
Snap-shot mechanisms are used to read a globally consistent set of variable values. Such a mechanism can be used to solve a variety of communication and synchronization problems, ...