A variety of factors is making it increasingly difficult and expensive to design and manufacture traditional Application Specific Integrated Circuits (ASICs). This has started a s...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...
Embedded memory blocks are important resources in contemporary FPGA devices. When targeting FPGAs, application designers often specify high-level memory functions which exhibit a ...
Russell Tessier, Vaughn Betz, David Neto, Thiagara...