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ICCD
2002
IEEE
146views Hardware» more  ICCD 2002»
16 years 1 months ago
From ASIC to ASIP: The Next Design Discontinuity
A variety of factors is making it increasingly difficult and expensive to design and manufacture traditional Application Specific Integrated Circuits (ASICs). This has started a s...
Kurt Keutzer, Sharad Malik, A. Richard Newton
SLIP
2009
ACM
15 years 11 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
SBCCI
2009
ACM
131views VLSI» more  SBCCI 2009»
15 years 9 months ago
Twin logic gates: improved logic reliability by redundancy concerning gate oxide breakdown
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
Hagen Sämrow, Claas Cornelius, Frank Sill, An...
DAC
2010
ACM
15 years 8 months ago
Cost-aware three-dimensional (3D) many-core multiprocessor design
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...
Jishen Zhao, Xiangyu Dong, Yuan Xie
FPGA
2006
ACM
129views FPGA» more  FPGA 2006»
15 years 8 months ago
Power-aware RAM mapping for FPGA embedded memory blocks
Embedded memory blocks are important resources in contemporary FPGA devices. When targeting FPGAs, application designers often specify high-level memory functions which exhibit a ...
Russell Tessier, Vaughn Betz, David Neto, Thiagara...