Virtually every system designed today is an amalgam of hardware and software. Unfortunately, software and circuits that communicate across the hardware/software boundary are tedio...
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
SRAM design has been a major challenge for nanoscale manufacturing technology. We propose a new bit cell repair scheme for designing maximum-information memory system (MIMS). Unli...
A new ultra low-power Class-AB Sinh integrator is proposed here. The translinear companding integrator is based on hyperbolic-sine transconductors and uses only one grounded capac...