In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
— In this paper, we describe a new approach for the extrinsic calibration of a camera with a 3D laser range finder, that can be done on the fly. This approach does not require an...
Painting on 3D surfaces is an important operation in computer graphics, virtual reality, and computer aided design. The painting styles in existing WYSIWYG systems can be awkward,...
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
The instabilities of the medial axis of a shape under deformations have long been recognized as a major obstacle to its use in recognition and other applications. These instabilit...