94 search results - page 14 / 19 » CAD tools for aesthetic engineering |
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
WETICE
1997
IEEE
13 years 11 months ago
1997
IEEE
When an artifact is designed the typical output consists of documents describing the final result of a long series of deliberations and tradeoffs by the participants of collaborat...
WSCG
2004
13 years 8 months ago
2004
This paper presents an interactive environment for texturing surfaces of arbitrary 3D objects. By uniquely using solid textures and applying them to the surface, we do not require...
DAC
1997
ACM
13 years 11 months ago
1997
ACM
A number of industry trends are shaping the requirements for IC and electronic equipment design. The density and complexity of circuit technologies have increased to a point where...
CAD
2008
Springer
13 years 7 months ago
2008
Springer
The main difficulty associated with a collaborative design process is understanding the product data exchanged during design. Efficient and effective coordination of design activi...