As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
We present mango, a low-cost and highly scalable content-delivery service for mobile phones. The service is targeted at emerging countries such as India where users are highly pri...
Ankur Jain, Sharad Jaiswal, Anirban Majumder, K. V...
Abstract-- This paper describes an overview of our semiautonomous (SA) wheelchair prototype and emphasizes the design of the perceptual navigation system. The goal of our project i...
In modern superscalar processors, the complex instruction scheduler could form the critical path of the pipeline stages and limit the clock cycle time. In addition, complex schedu...
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
Balaji Vaidyanathan, Wei-Lun Hung, Feng Wang 0004,...