44 search results - page 6 / 9 » Cell selection from technology libraries for minimizing powe... |
HPCA
2011
IEEE
12 years 11 months ago
2011
IEEE
Extreme technology integration in the sub-micron regime comes with a rapid rise in heat dissipation and power density for modern processors. Dynamic voltage scaling is a widely us...
EUROPAR
2009
Springer
13 years 11 months ago
2009
Springer
Abstract. In the field of HPC, the current hardware trend is to design multiprocessor architectures that feature heterogeneous technologies such as specialized coprocessors (e.g., ...
ISQED
2006
IEEE
14 years 1 months ago
2006
IEEE
As a result of aggressive technology scaling, gate leakage (gate oxide direct tunneling) has become a major component of total power dissipation. Use of dielectrics of higher perm...
BMCBI
2010
13 years 7 months ago
2010
Background: Current imaging methods such as Magnetic Resonance Imaging (MRI), Confocal microscopy, Electron Microscopy (EM) or Selective Plane Illumination Microscopy (SPIM) yield...
ICCD
2004
IEEE
14 years 4 months ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...