658 search results - page 117 / 132 » Challenges in Physical Chip Design |
CASES
2008
ACM
13 years 11 months ago
2008
ACM
Dynamic binary translators (DBT) have recently attracted much attention for embedded systems. The effective implementation of DBT in these systems is challenging due to tight cons...
CORR
2008
Springer
13 years 9 months ago
2008
Springer
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
ISCA
2006
IEEE
13 years 9 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
BMCBI
2004
13 years 8 months ago
2004
Background: High-density oligonucleotide microarray technology enables the discovery of genes that are transcriptionally modulated in different biological samples due to physiolog...
ET
2002
13 years 8 months ago
2002
LVDS is the acronym for Low-Voltage-DifferentialSignaling and is described in both the ANSI/TIA/EIA644 and IEEE 1596.3 standards. High performance yet Low Power and EMI have made ...