Sciweavers

658 search results - page 62 / 132
» Challenges in Physical Chip Design
Sort
View
DATE
2009
IEEE
155views Hardware» more  DATE 2009»
14 years 3 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
SAMOS
2005
Springer
14 years 2 months ago
Modeling NoC Architectures by Means of Deterministic and Stochastic Petri Nets
The design of appropriate communication architectures for complex Systems-on-Chip (SoC) is a challenging task. One promising alternative to solve these problems are Networks-on-Chi...
Holger Blume, Thorsten von Sydow, Daniel Becker, T...
DATE
2004
IEEE
132views Hardware» more  DATE 2004»
14 years 15 days ago
Hybrid Architectural Dynamic Thermal Management
When an application or external environmental conditions cause a chip's cooling capacity to be exceeded, dynamic thermal management (DTM) dynamically reduces the power densit...
Kevin Skadron
JSA
2007
123views more  JSA 2007»
13 years 8 months ago
Application of deterministic and stochastic Petri-Nets for performance modeling of NoC architectures
The design of appropriate communication architectures for complex Systems-on-Chip (SoC) is a challenging task. One promising alternative to solve these problems are Networks-on-Ch...
Holger Blume, Thorsten von Sydow, Daniel Becker, T...
JETC
2008
127views more  JETC 2008»
13 years 7 months ago
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
Yong Zhan, Sachin S. Sapatnekar