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ICCAD
2008
IEEE
130views Hardware» more  ICCAD 2008»
14 years 3 months ago
Area-I/O flip-chip routing for chip-package co-design
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
Jia-Wei Fang, Yao-Wen Chang
ACSAC
2007
IEEE
14 years 3 months ago
Toward Realistic and Artifact-Free Insider-Threat Data
Progress in insider-threat detection is currently limited by a lack of realistic, publicly available, real-world data. For reasons of privacy and confidentiality, no one wants to...
Kevin S. Killourhy, Roy A. Maxion
CEC
2007
IEEE
14 years 3 months ago
Target shape design optimization by evolving splines
Abstract— Target shape design optimization problem (TSDOP) is a miniature model for real world design optimization problems. It is proposed as a test bed to design and analyze op...
Pan Zhang, Xin Yao, Lei Jia, Bernhard Sendhoff, Th...
DASFAA
2007
IEEE
150views Database» more  DASFAA 2007»
14 years 3 months ago
TinTO: A Tool for the View-Based Analysis of Streams of Stock Market Data
TinTO is an experimental system aiming at demonstrating the usefulness and feasibility of applying conventional SQL queries for analyzing a wide spectrum of data streams. As applic...
Andreas Behrend, Christian Dorau, Rainer Manthey
MICRO
2007
IEEE
133views Hardware» more  MICRO 2007»
14 years 3 months ago
Revisiting the Sequential Programming Model for Multi-Core
Single-threaded programming is already considered a complicated task. The move to multi-threaded programming only increases the complexity and cost involved in software developmen...
Matthew J. Bridges, Neil Vachharajani, Yun Zhang, ...