82 search results - page 13 / 17 » Clockless IC design using handshake technology |
ISQED
2002
IEEE
14 years 1 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
ASPDAC
2007
ACM
14 years 16 days ago
2007
ACM
With semiconductor fabrication technologies scaled below 100 nm, the design-manufacturing interface becomes more and more complicated. The resultant process variability causes a nu...
DAC
1997
ACM
14 years 22 days ago
1997
ACM
A number of industry trends are shaping the requirements for IC and electronic equipment design. The density and complexity of circuit technologies have increased to a point where...
ICS
2009
Tsinghua U.
14 years 1 months ago
2009
Tsinghua U.
Large Multi-Processor Systems-on-Chip use Networks-on-Chip with a high degree of reusability and scalability for message communication. Therefore, network infrastructure is a cruc...
CORR
2008
Springer
13 years 8 months ago
2008
Springer
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...