362 search results - page 23 / 73 » Communication Mechanisms for Parallel DSP Systems on a Chip |
IEICET
2010
13 years 6 months ago
2010
This paper shows experimental results of packet error rates (PERs) in wireless-LAN mounted printed circuit boards and gives a discussion on a mechanism of electromagnetic noise cou...
ICDCS
1997
IEEE
14 years 3 days ago
1997
IEEE
The Collaborative Computing Transport Layer (CCTL) is a communication substrate consisting of a suite of multiparty protocols, providing varying service qualities among process gr...
ICS
2005
Tsinghua U.
14 years 1 months ago
2005
Tsinghua U.
Parallel I/O needs to keep pace with the demand of high performance computing applications on systems with ever-increasing speed. Exploiting high-end interconnect technologies to ...
CODES
2005
IEEE
13 years 9 months ago
2005
IEEE
We propose a secure platform on a chip multiprocessor, known as FIDES, in order to enable next generation mobile terminals to execute downloaded native applications for Linux. Its...
CORR
2007
Springer
13 years 7 months ago
2007
Springer
This paper presents a methodology to efficiently explore the design space of communication adapters. In most digital signal processing (DSP) applications, the overall performance ...