Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
This paper examines two alternative approaches to supporting code scheduling for multiple-instruction-issue processors. One is to provide a set of non-trapping instructions so tha...
Pohua P. Chang, William Y. Chen, Scott A. Mahlke, ...
Many different video processor architectures exist. Its architecture gives a processor strength for a particular application. Hardwired logic yields the best performance/cost, but ...
Network performance in tightly-coupled multiprocessors typically degrades rapidly beyond network saturation. Consequently, designers must keep a network below its saturation point...
Mithuna Thottethodi, Alvin R. Lebeck, Shubhendu S....
This paper presents a novel power reduction method for chip multi-processors (CMPs) under real-time constraints. While the power consumption of processing units (PUs) on CMPs can ...