Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
: This paper analyses the requirements of automation and adaptation in the so called perceptive environments. These environments are places with the ability of perceiving the conte...
In this paper, we focus on the adaptation problem that has a large labeled data in the source domain and a large but unlabeled data in the target domain. Our aim is to learn relia...
Mixed-initiativesystemspresent the challengeof finding an effective level of interaction betweenhumans and computers. Machinelearning presents a promising approachto this problemi...
In this paper, we describe the design steps of extending LAOS, a five-layer framework for generic adaptive web learning authoring, by adding a social layer to capture (and adapt) i...