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DATE
2007
IEEE
15 years 10 months ago
2007
IEEE
Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal e ects impact a...
132
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DATE
2007
IEEE
15 years 10 months ago
2007
IEEE
This paper presents a new blocking logic to block unknowns for temporal compactors. The proposed blocking logic can reduce data volume required to control the blocking logic and a...
133
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DATE
2007
IEEE
15 years 10 months ago
2007
IEEE
Future microprocessors will be highly susceptible to transient errors as the sizes of transistors decrease due to CMOS scaling. Prior techniques advocated full scale structural or...
131
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DATE
2007
IEEE
15 years 10 months ago
2007
IEEE
The amount of electronic systems introduced in vehicles is continuously increasing: X-by-wire, complex electronic control systems and above all future applications such as automot...
127
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DATE
2007
IEEE
15 years 10 months ago
2007
IEEE
Embedded First-In First-Out (FIFO) memories are increasingly used in many IC designs. We have created a new full-custom embedded FIFO module with asynchronous read and write clock...