434 search results - page 31 / 87 » Design Methodologies and Architecture Solutions for High-Per... |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
DAC
1999
ACM
14 years 8 months ago
1999
ACM
This paper presents a methodology for cycle-accurate simulation of energy dissipation in embedded systems. The ARM Ltd. 1 instruction-level cycle-accurate simulator is extended wi...
DSN
2006
IEEE
14 years 1 months ago
2006
IEEE
The advent of deep sub-micron technology has exacerbated reliability issues in on-chip interconnects. In particular, single event upsets, such as soft errors, and hard faults are ...
MSS
2007
IEEE
14 years 2 months ago
2007
IEEE
The high demand for large scale storage capacity calls for the availability of massive storage solutions with high performance interconnects. Although cluster file systems are rap...
ATAL
2000
Springer
14 years 2 days ago
2000
Springer
This chapter addresses the problem of producing and maintaining progress in agent design. New architectures often hold important insights into the problems of designing intelligenc...