Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
— In this paper, we present a high-level power model to estimate the power consumption in semi-global and global interconnects. Such interconnects are used for communications bet...
We present a tool that provides effective graphical animations as a means of validating both goals and software designs. Goals are objectives that a system is expected to meet. Th...
Problem Solving Environments have a well established position as an essential tool for computational science. We focus our attention in this article on how to provide parallel com...
Simultaneous Multi-Threading (SMT) processors are becoming popular because they exploit both instruction-level and threadlevel parallelism by issuing instructions from different t...