The ability to account for the growing impacts of multiple process variations in modern technologies is becoming an integral part of nanometer VLSI design. Under the context of ti...
We present a novel temperature/leakage sensor, developed for high-speed, low-power, monitoring of processors and complex VLSI chips. The innovative idea is the use of 4T SRAM cell...
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
In chip multiprocessors (CMPs), data accesslatency dependson the memory hierarchy organization, the on-chip interconnect (NoC), and the running workload. Reducing data access late...
—We present an implementation of an algorithm for constructing provably fast circuits for a class of Boolean functions with input signals that have individual starting times. We ...