The proposed software technique is a very low cost and an effective solution towards designing Byzantine fault tolerant computing application systems that are not so safety critic...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
The Reusable Software Fault Tolerance Testbed ReSoFT was developed to facilitate the development and evaluation of high-assurance systems that require tolerance of both hardware...
Kam S. Tso, Eltefaat Shokri, Roger J. Dziegiel Jr.
Abstract—Networks-on-Chip (NoCs) are implicitly fault tolerant due to their inherent redundancy. They can overcome defective cores, links and switches. As a side effect, yield is...
Atefe Dalirsani, Stefan Holst, Melanie Elm, Hans-J...
In recent years the application space of reconfigurable devices has grown to include many platforms with a strong need for fault tolerance. While these systems frequently contain ...