2546 search results - page 444 / 510 » Designing the Future |
134
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DAC
2010
ACM
15 years 8 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
126
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ECBS
2009
IEEE
15 years 8 months ago
2009
IEEE
Future space missions such as the Mars Science Laboratory and Project Constellation suggest the engineering of some of the most complex man-rated software systems. The present pro...
139
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ICAIL
2007
ACM
15 years 8 months ago
2007
ACM
Legal-RDF.org1 publishes a practical ontology that models both the layout and content of a document and metadata about the document; these have been built using data models implici...
132
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CF
2006
ACM
15 years 7 months ago
2006
ACM
The slowing pace of commodity microprocessor performance improvements combined with ever-increasing chip power demands has become of utmost concern to computational scientists. As...
107
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FPGA
2006
ACM
15 years 7 months ago
2006
ACM
Many System-on-a-Chip devices would benefit from the inclusion of reprogrammable logic on the silicon die, as it can add general computing ability, provide run-time reconfigurabil...