Diagnosis is increasingly important, not only for individual analysis of failing ICs, but also for high-volume test response analysis which enables yield and test improvement. Sca...
Dan Adolfsson, Joanna Siew, Erik Jan Marinissen, E...
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...