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CODES
2007
IEEE
14 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
IEEEPACT
2007
IEEE
14 years 4 months ago
Performance Portable Optimizations for Loops Containing Communication Operations
Effective use of communication networks is critical to the performance and scalability of parallel applications. Partitioned Global Address Space languages like UPC bring the pro...
Costin Iancu, Wei Chen, Katherine A. Yelick
INFOCOM
2007
IEEE
14 years 4 months ago
Queuing Delays in Randomized Load Balanced Networks
—Valiant’s concept of Randomized Load Balancing (RLB), also promoted under the name ‘two-phase routing’, has previously been shown to provide a cost-effective way of implem...
Ravi Prasad, Peter J. Winzer, Sem C. Borst, Marina...
APPROX
2007
Springer
112views Algorithms» more  APPROX 2007»
14 years 4 months ago
Encouraging Cooperation in Sharing Supermodular Costs
Abstract Consider a situation where a group of agents wishes to share the costs of their joint actions, and needs to determine how to distribute the costs amongst themselves in a f...
Andreas S. Schulz, Nelson A. Uhan
ISSAC
2007
Springer
177views Mathematics» more  ISSAC 2007»
14 years 4 months ago
Component-level parallelization of triangular decompositions
We discuss the parallelization of algorithms for solving polynomial systems symbolically by way of triangular decompositions. We introduce a component-level parallelism for which ...
Marc Moreno Maza, Yuzhen Xie