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DATE
2009
IEEE
154views Hardware» more  DATE 2009»
15 years 11 months ago
Reliability aware through silicon via planning for 3D stacked ICs
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
132
Voted
SETN
2004
Springer
15 years 10 months ago
A Multi-agent System for Microgrids
Abstract. This paper presents the capabilities offered by MultiAgent System technology in the operation of a Microgrid. A Microgrid is a new type of power system, which is formed b...
Aris Dimeas, Nikos D. Hatziargyriou
109
Voted
DATE
2010
IEEE
122views Hardware» more  DATE 2010»
15 years 9 months ago
Equivalent circuit modeling of multilayered power/ground planes for fast transient simulation
—This paper presents a modeling method for power distribution networks (PDNs) consisting of multilayered power/ground planes of the PCB/Package. Using our proposed method, multip...
Takayuki Watanabe, Hideki Asai
ASPLOS
2012
ACM
14 years 10 days ago
Reflex: using low-power processors in smartphones without knowing them
To accomplish frequent, simple tasks with high efficiency, it is necessary to leverage low-power, microcontroller-like processors that are increasingly available on mobile systems...
Felix Xiaozhu Lin, Zhen Wang, Robert LiKamWa, Lin ...
129
Voted
ACSC
2002
IEEE
15 years 9 months ago
AdJava - Automatic Distribution of Java Applications
The majority of the world’s computing resources remains idle most of the time. By using this resource pool, an individual computation may be completed in a fraction of time requ...
Mohammad M. Fuad, Michael J. Oudshoorn