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ICCAD
2005
IEEE
14 years 5 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
CP
2009
Springer
14 years 3 months ago
2009
Springer
Abstract. The global cumulative constraint was proposed for modelling cumulative resources in scheduling problems for finite domain (FD) propagation. Since that time a great deal ...
EPIA
1999
Springer
14 years 1 months ago
1999
Springer
OPL is a modeling language for mathematical programming and combinatorial optimization problems. It is the first modeling language to combine high-level algebraic and set notation...
HCI
2001
13 years 10 months ago
2001
The great variety of users of the services available on the internet raised the problem of finding flexible forms of presentation and interaction, which depend on the specific user...
WSC
2000
13 years 10 months ago
2000
Discrete Event Simulation (DES) has been used as a design and validation tool in various production and business applications. DES can also be utilized for analyzing the product-m...