288 search results - page 6 / 58 » Dynamic Thermal Management through Task Scheduling |
ASPDAC
2010
ACM
13 years 5 months ago
2010
ACM
Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various power and performance characteristics can customize their configuration to achieve higher ...
ISPASS
2009
IEEE
14 years 2 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
CLUSTER
2007
IEEE
14 years 1 months ago
2007
IEEE
— The thermal environment of data centers plays a significant role in affecting the energy efficiency and the reliability of data center operation. A dominant problem associate...
RTAS
2010
IEEE
13 years 6 months ago
2010
IEEE
—Thermal control is crucial to real-time systems as excessive processor temperature can cause system failure or unacceptable performance degradation due to hardware throttling. R...
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...