76 search results - page 10 / 16 » Dynamic thermal management in 3D multicore architectures |
MICRO
2005
IEEE
14 years 2 months ago
2005
IEEE
Various architectural power reduction techniques have been proposed for on-chip caches in the last decade. In this paper, we first show that these power reduction techniques can b...
DAC
2006
ACM
13 years 10 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
DAC
2009
ACM
14 years 3 months ago
2009
ACM
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
ISCA
2003
IEEE
14 years 1 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ASPLOS
2008
ACM
13 years 10 months ago
2008
ACM
Future multicore processors will be more susceptible to a variety of hardware failures. In particular, intermittent faults, caused in part by manufacturing, thermal, and voltage v...