303 search results - page 8 / 61 » Dynamic thermal management via architectural adaptation |
CGO
2005
IEEE
14 years 1 months ago
2005
IEEE
To minimize the surging power consumption of microprocessors, adaptive computing environments (ACEs) where microarchitectural resources can be dynamically tuned to match a program...
TVLSI
2008
13 years 7 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
ISCA
2003
IEEE
14 years 22 days ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ICSOC
2009
Springer
13 years 5 months ago
2009
Springer
Business processes must become agile, respond to changes in the business environment in a timely manner and quickly adapt themselves to new conditions. Event-Driven Business Proces...
DATE
2010
IEEE
14 years 16 days ago
2010
IEEE
— The use of dynamic voltage and frequency scaling (DVFS) in contemporary multicores provides significant protection from unpredictable thermal events. A side effect of DVFS can ...