303 search results - page 9 / 61 » Dynamic thermal management via architectural adaptation |
ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
DAC
2006
ACM
13 years 9 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
DAC
2009
ACM
14 years 2 months ago
2009
ACM
It is known that temperature gradients and thermal hotspots affect the reliability of microprocessors. Temperature is also an important constraint when maximizing the performance...
IPPS
2002
IEEE
14 years 11 days ago
2002
IEEE
This paper presents preliminary efforts to develop compilation and execution environments that achieve performance portability of multilevel parallelization on hierarchical archit...
ISLPED
2009
ACM
14 years 1 months ago
2009
ACM
With the popularity of multi-core architecture, to sustain the memory demands from different cores, the memory system is expected to grow significantly in both speed and capacit...