As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
— Many of the issues that will be faced by the designers of multi-billion transistor chips may be alleviated by the presence of a flexible global communication infrastructure. I...
Abstract--Due to technology or policy constraints, communications across network domains usually require the intervention of gateways, and their proper deployment is crucial to the...
Ting He, Kang-Won Lee, Nikoletta Sofra, Kin K. Leu...
Although a lot of research efforts have been made in the minimization of the total power consumption caused by the clock tree, no attention has been paid to the minimization of th...
With the proliferation of WiFi technology, many WiFi networks are accessible from vehicles on the road making vehicular WiFi access realistic. However, several challenges exist: l...