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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
14 years 3 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
DAC
2005
ACM
14 years 10 months ago
Temperature-aware resource allocation and binding in high-level synthesis
Physical phenomena such as temperature have an increasingly important role in performance and reliability of modern process technologies. This trend will only strengthen with futu...
Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Mem...
CODES
2005
IEEE
14 years 3 months ago
System-level design automation tools for digital microfluidic biochips
Biochips based on digital microfluidics offer a powerful platform for massively parallel biochemical analysis such as clinical diagnosis and DNA sequencing. Current full-custom de...
Krishnendu Chakrabarty, Fei Su
SLIP
2004
ACM
14 years 3 months ago
Interconnect-power dissipation in a microprocessor
Interconnect power is dynamic power dissipation due to switching of interconnection capacitances. This paper describes the characterization of interconnect power in a state-of-the...
Nir Magen, Avinoam Kolodny, Uri C. Weiser, Nachum ...
FPL
2005
Springer
115views Hardware» more  FPL 2005»
14 years 3 months ago
Statistical Power Estimation for FPGA
This article presents a power estimation tool integrated with an FPGA design flow. It is able to estimate total and individual-node average power consumption for combinational blo...
Elias Todorovich, Fabian Angarita, Javier Valls, E...