116 search results - page 5 / 24 » Electromigration-Aware Physical Design of Integrated Circuit... |
GLVLSI
2003
IEEE
14 years 2 months ago
2003
IEEE
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
DAC
2012
ACM
12 years 1 days ago
2012
ACM
We develop a projected-subgradient primal-dual Lagrange optimization for global placement, that can be instantiated with a variety of interconnect models. It decomposes the origin...
GECCO
2007
Springer
14 years 3 months ago
2007
Springer
In this paper, a new method for evolving simple electronic circuits is discussed, with the aim of improving the reliability and performance of basic circuit blocks. Next-generatio...
DAC
2006
ACM
14 years 10 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
DAC
2004
ACM
14 years 10 months ago
2004
ACM
The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated cir...