116 search results - page 8 / 24 » Electromigration-Aware Physical Design of Integrated Circuit... |
FPGA
2001
ACM
14 years 2 months ago
2001
ACM
As integrated circuits are migrated to more advanced technologies, it has become clear that crosstalk is an important physical phenomenon that must be taken into account. Crosstal...
ISMVL
2008
IEEE
14 years 4 months ago
2008
IEEE
Nanoscale multiple-valued logic systems require the development of nanometer scale integrated circuits and components. Due to limits in device physics, new components must be deve...
DAC
2005
ACM
13 years 11 months ago
2005
ACM
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
ICCAD
2000
IEEE
14 years 2 months ago
2000
IEEE
The increasing size of integrated systems combined with deep submicron physical modeling details creates an explosion in RLC interconnect modeling complexity of unmanageable propo...
ICCAD
2009
IEEE
13 years 7 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...