257 search results - page 49 / 52 » Electronic circuit reliability modeling |
DAC
2010
ACM
14 years 1 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
ECAL
1995
Springer
14 years 1 months ago
1995
Springer
After an outline of the history of evolutionary algorithms, a new ( ) variant of the evolution strategies is introduced formally. Though not comprising all degrees of freedom, it i...
CP
2008
Springer
13 years 11 months ago
2008
Springer
Rectangle (square) packing problems involve packing all squares with sizes 1 × 1 to n × n into the minimum area enclosing rectangle (respectively, square). Rectangle packing is a...
TCOM
2010
13 years 8 months ago
2010
- Phase noise is a topic of theoretical and practical interest in electronic circuits. Although progress has been made in the characterization of its description, there are still c...
SIGECOM
2008
ACM
13 years 9 months ago
2008
ACM
Computer users express a strong desire to prevent attacks and to reduce the losses from computer and information security breaches. However, security compromises are common and wi...