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CODES
2007
IEEE
15 years 10 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
BMCBI
2004
75views more  BMCBI 2004»
15 years 4 months ago
Structural characterization of genomes by large scale sequence-structure threading
Background: Using sequence-structure threading we have conducted structural characterization of complete proteomes of 37 archaeal, bacterial and eukaryotic organisms (including wo...
Artem Cherkasov, Steven J. M. Jones
WOSP
2010
ACM
15 years 11 months ago
A general result for deriving product-form solutions in markovian models
In this paper we provide a general method to derive productform solutions for stochastic models. We take inspiration from the Reversed Compound Agent Theorem [14] and we provide a...
Andrea Marin, Maria Grazia Vigliotti
SEM
2004
Springer
15 years 9 months ago
PlanetSim: A New Overlay Network Simulation Framework
Abstract. Current research in peer to peer systems is lacking appropriate environments for simulation and experimentation of large scale overlay services. This has led to a plethor...
Pedro García López, Carles Pairot, R...
WSC
2004
15 years 5 months ago
Implementing the High Level Architecture in the Virtual Test Bed
The Virtual Test Bed (VTB) is a prototype of a virtual engineering environment to study operations of current and future space vehicles, spaceports, and ranges. The HighLevel Arch...
José A. Sepúlveda, Luis C. Rabelo, J...